Processor Identification
Processor Package Form Factors
There are
five form factors for Pentium® III, Pentium II,
and Intel® Celeron™ processors: S.E.P., S.E.C.C., S.E.C.C.2,
FC-PGA, and the PPGA form factor. These five form factors are
illustrated below along with a brief explanation of how to
easily identify them.
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S.E.P.
Form Factor
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Boxed
processors in the S.E.P. form factor are not completely
covered by the blackplastic shrouding like the
S.E.C.C.and S.E.C.C.2 form factors are. The
substrate(circuit board) is visible from the bottom
side. |
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S.E.C.C.
Form Factor
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Boxed
processors in the S.E.C.C. form factor have a plastic
shroud covering with an active heatsink and fan. The
best way to identify this package form factor is by the
goldfinger contacts - on a S.E.C.C. form factor, they
are seated inside of the plastic housing.
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S.E.C.C.2
Form Factor
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Like
the S.E.C.C. form factor, boxed processors in the
S.E.C.C.2 form factor have a plastic housing with active
heatsink and fan. The most noticeable difference is that
the goldfinger contacts are exposed on the S.E.C.C.2
form factor as shown in this photo. |
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PPGA
Form Factor
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Boxed
processors in the PPGA form factor are in a 370-pin
socket form factor instead of the slot connector form
factor. You can tell if you have a processor in the PPGA
form factor by locating the Pin Grid Array on its
underside. Slot connector form factors do not have pins. |
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FC-PGA
Form Factor
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Boxed
processors in the FC-PGA form factor are also in a
370-pin socket form factor instead of the slot connector
form factor. You can tell if you have a processor with a
FC-PGA package by locating the Pin Grid Array on its
underside. Slot connector form factors do not have pins. |
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